product bulletin dimensions ? millimeters (inches) see capacitance value table below for thickness dimension. outline drawing
c 0805 f 684 k 4 r a c style c - ceramic size code see dimension table specification f - open mode capacitance code, pf first two digits represent significant figures. third digit specifies number of zeros. 100 pf = 101. (use ?9? for 1.0 through 9.9 pf) (use ?8? for 0.1 through .99 pf) capacitance tolerance k = 10% m = 20% voltage 4 = 16v 3 = 25v 5 = 50v temperature characteristic designated by capacitance change over temperature range r = x7r (15%) (-55c +125c) end metallization c = standard (tin-plate nickel barrier) failure rate level a = not applicable capacitor ordering information f-9073b 9/06 surface mount ceramic chip capacitors ? open mode - x7r - capacitance extensions eia size metric size l w b s code code length width bandwidth seperation 0805 2012 2.0 (.079) 0.02 (.008) 1.25 (.049) 0.2 (.008) 0.5 (.020) 0.25 (.010) 0.75 (.030) 1206 3216 3.2 (1.26) 0.2(.008) 1.6 (.063) 0.2 (.008) 0.5 (.020) 0.25 (.010) - 1210 3225 3.2 (.126) 0.2 (.008) 2.5 (.098) 0.2 (.008) 0.5 (.020) 0.25 (.010) - the open-mode dimension (om) exceeds the termination bandwidth dimensions: om >bw
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com capacitance value f-9073b 9/06 electrical parameters as detailed in the kemet s urface mount catalog f3102 for x7r, with the following specific requirements based on room temperature (25 c) parameters: operating range: - 55 c to +125 c, with no - bias capacitance shift limited to the 15% over that range . insulating resistance (ir) measured after 2 minutes at rated voltage @25c: limit is 500 megohm- microfarads or 10,000mw , whichever of the two is smaller. capacitance and dissipation factor (df) are measured under the following conditions: 1khz and 1 vrms if capacitance * 10 f 120hz and 0.5 vrms if capacitance $ 10 f df limits: 50 - 200 volts 2.5% 16 - 25 volts 3.5% 6.3 / 10 volts 5.0% soldering process all parts incorporate the standard kemet barrier layer of pure nickel, with an ove rplate of pure tin to provide excellent solderability as well as resistance to leaching. the recommended mounting technique s are as follows : 0402 / 1210 c ase size s s older r eflow 0603 / 0805 / 1206 case sizes solder wave / solder reflow marking these chips will be supplied unmarked. if required, they can be laser - marked as an extra option. details on the marking format are included in kemet surface mount catalog f3102. in general, the information provided in the kemet surface mount catalog f3102 appl ies to these capacitors. the information in this bulletin supplements that in the catalog capacitance value (f) kemet part number voltage capacitance tolerance thickness qty 7" reel qty 13" reel 0.22 c0805f224_3rac 25 k, m 0.90 (.035) 0.10 (.004) 4,000 10,000 0.22 c0805f224_5rac 50 k, m 1.25 (.049) 0.15 (.006) 2,500 10,000 0.47 c0805f474_4rac 16 k, m 1.00 (.039) 0.10 (.004) 2,500 10,000 0.47 c0805f474_3rac 25 k, m 1.25 (.049) 0.15 (.006) 2,500 10,000 0.68 c0805f684_4rac 16 k, m 1.25 (.049) 0.15 (.006) 2,500 10,000 0.47 c1206f474_5rac 50 k, m 0.90 (.035) 0.10 (.004) 4,000 10,000 1 c1206f105_3rac 25 k, m 0.90 (.035) 0.10 (.004) 4,000 10,000 1 c1206f105_5rac 50 k, m 1.60 (.063) 0.20 (.008) 2,000 8,000 2.2 c1206f225_4rac 16 k, m 0.90 (.035) 0.10 (.004) 4,000 10,000 2.2 c1206f225_3rac 25 k, m 1.60 (.063) 0.20 (.008) 2,000 8,000 4.7 c1206f475_4rac 16 k, m 1.60 (.063) 0.20 (.008) 2,000 8,000 2.2 c1210f225_5rac 50 k, m 1.70 (.067) 0.20 (.008) 2,000 8,000 4.7 c1210f475_4rac 16 k, m 1.25 (.049) 0.15 (.006) 2,500 10,000 4.7 c1210f475_3rac 25 k, m 1.70 (.067) 0.20 (.008) 2,000 8,000
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